Characterization of lithographically printed resistive strain gauges
نویسندگان
چکیده
منابع مشابه
Hysteresis and Material Effects of Printed Strain Gauges Embedded in Organic Coatings
This work reports on the hysteresis behavior and an initial baseline drift of printed strain gauges embedded in organic coating layers on sheet steel that we recently introduced. We subsequently investigated the performance over an extended period of time, which revealed interesting and partially unexpected material properties of printed strain gauges made from silver and carbon. Both silverand...
متن کاملNonlinearity and Hysteresis of Resonant Strain Gauges
Nonlinearity and hysteresis effects of electrostatically activated, voltage driven resonant microbridges have been studied theoretically and experimentally. It is shown, that, in order to avoid vibration instability and hysteresis to occur, the choices of the ax . and d.c. driving voltages and of the quality factor of a resonator, with a given geometry and choice of materials, are limited by a ...
متن کاملComparisons between Membrane, Bridge and Cantilever Miniaturized Resistive Vacuum Gauges
Using bulk micromachining, meander-shaped resistor elements consisting of 20 nm Cr and 200 nm Au were fabricated on 1 μm thick silicon nitride membranes, bridges, and cantilevers. The resistance change as a function of pressure depends strongly on the thermal resistance of the two metal lines connecting the heated resistor to the silicon bulk (cold junction) and on the thermal resistance of the...
متن کاملSmall angle X-ray scattering coupled with in situ electromechanical probing of nanoparticle-based resistive strain gauges.
A comprehensive study on the electromechanical behavior of nanoparticle-based resistive strain gauges in action through normal and grazing incidence small angle X-ray scattering (SAXS/GISAXS) investigations is presented. The strain gauges were fabricated from arrays of colloidal gold nanoparticle (NP) wires assembled on flexible polyethylene terephthalate and polyimide substrates by convective ...
متن کاملMeasurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges "2279
Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations (or warpage) of a bi-material plate and a PCB with dual in-line memory module (DIMM) sockets during solder reflow heating, while the finite elemen...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: IEEE Sensors Journal
سال: 2005
ISSN: 1530-437X
DOI: 10.1109/jsen.2005.845209